July 2010

 High performance datamatrix reader
Customer:Tecnic B.V.
 
Application:Reading various datamatrix codes on different type of petri dishes. The transportation speed is 0.5m/s and to avoid motion blur, special illumination (LED illumination with overstrobing technology, flash time less than 50 microseconds) is used. The flashes generated by the illumination are too short to be visible for the human eye. Image processing is performed inside the camera. Found datacodes are send to a PLC for further handling.
 
Camera Spec:1 Leutron CheckSight CPU camera with 5MP resolution. HALCON is being used for the image processing, average datamatrix readout ~30mseconds. Integration time 40 microseconds. Framerate 5fps and approximately 5 datacodes per frame.
 
Camera used:CheckSight P202M, sensor 1/1.8, CCD, resolution: 1624 x 1236 , fps: 14, global shutter, mono
 
 Petri dish handling machine
 High performance datamatrix reader 

More samples will follow soon!

 Cheese package orientation
Customer:Roboxis B.V.
 
Application:The orientation of cheese packages need to be detected with high accuracy, in four different lanes. A T-Robot exchanges cheese pieces from one package to the other.
 
Camera Spec:2 SVGA Leutron PicSight cameras in combination with image processing library HALCON. Communication between robot and camera: GigE ethernet. VGA-out is used to visualize results on screen.
 
Camera used:Leutron PicSight P83M-Smart502-AS; Sensor 1/3 CCD 1024 x 768, monochrome
 
 1) Snapshot cheese package 2) Determine orientation 3) Rectify cheese package
 Cheese orientation
 

Machine in production



 Remote-controlled flying drone
Customer:Microdrones GMBH.
 
Application:An intelligent camera from VRmagic undertakes the automatic landing of a flying drone from Microdrones. A tracking algorithm on the camera analyses the height of the drone, its position and alignment in relation to the landing place.
 
Camera Spec:OEM Monochrome sensor752x480 69 CMOS
Camera used:VRmDC-12 


[table=tables-3d-effects-2 | Augmented Reality instead of Eye Drops |
Customer:| VRmagic GMBH.

 Virtual Mirror Kiosk
Customer:EzFace inc.
 
Application:In store kiosk allowing customers to apply a wide range of cosmetic and hair coloration products on their own photo.
 
Camera Spec:30FPS is preview mode (8 bits, 1.2MP) High quality capture (12 bits, 5MP) Color correction on the camera (Lookup table) Illumination control Flash support
Camera used:5MP CMOS Color USB2 camera Additional illumination card was developed with high power LEDS providing optional continues illumination and high intensity flash for the capture (Card is fully controlled from the camera using the standard SDK). 


 Auto-Refracto/Keratometer
Customer:Visionix
 
Application:Single device combining 4 devices in 1 : Auto Refractometer, Keratometer, Corneal Topographer and Aberrometer
Camera Spec:Windows XP support, High sensitivity monochrome sensor, Two cameras connected to one PC
Camera used: 1.3MP Monochrome CMOS Color USB2 camera (x2) 


 IT-READER
Customer:Diamed (Division of Bio-Rad)
 
Application:Hand held device for detection of malaria
Camera Spec:Color sensor, Barcode detection, On camera processing
Camera used: 3MP Color CMOS, Blackfin DSP for image processing, Customized Barcode detection on DSP, Prototype was built in 3 month using USB2 Model. Ported to full embedded system in 6 month 


More samples will be presented soon...

Specifications

IFM 3DSensor
      
TypeDimensionsOperating voltageSupply CurrentParameter settingProgramming interface
 
PMD137 x 75 x 9524 DC ± 10 %2500 mAvia 2 pushbuttons and 10-segment display or via PCEthernet; 10Base-T / 100Base-TX 


Used technology
The compact sensor from IFM uses time-of-flight distance measurement to identify the height of any object in the field of view. An integrated 64 x 48 pixel array – in which each pixel represents a time of flight measurement – defines the field of view for the sensor.

This technology provides critical information in applications such as palletzing and de-palletizing, material handling, bulk level of materials and intelligent routing/sorting. The 3D Image Sensor is a new benchmark for price / performance in reliable 3D object detection.


3D Image Sensor Uses Photonic Mixing Device (PMD) Principle Based on Time of Flight Measurement
The Photonic Mixing Device (PMD) principle is based on Time of Flight (TOF) distance measurement. In its most simple version, a light pulse is radiated from the sensor. This pulse is reflected by an object and detected by the sensor's smart pixel receiver element. A comparison between the optical and electrical reference signals yields an output signal that carries the desired distance information.

Time of Flight (TOF) distance measurement is not new to the market. The challenge is that traditional TOF components use a photodiode for a receiver element and require additional external electronics for signal acquisition and processing. These type of components are used to detect only one measurement and are costly due to the response time required for Time of Flight measurement. Using these existing TOF components to achieve 3D imaging can be expensive for industrial markets.


Realtime 3D imaging via time of flight

IFM introduces a new 3D Image Sensor that evaluates size, shape and level in material handling applications. The compact sensor uses time-of-flight distance measurement and photonic mixer device technology to identify an object in the sensor‘s field of view. An integrated 64 x 48 pixel array – in which each pixel represents a time of flight measurement – defines the field of view for the sensor.

The 3D sensor technology provides critical information in applications such as palletzing and de-palletizing, material handling, bulk level of materials and intelligent routing/sorting.


Technology
3D Image Sensor Uses Reliable Time of Flight Distance Measurement
In its most simple version, a light pulse is radiated from the sensor. This pulse is reflected by an object and detected by the sensor's smart pixel receiver element. A comparison between the optical and electrical reference signals yields an output signal that carries the desired distance information.

Robust, compact design for industrial applications
The solid-state, robust metal housing measures only 42 x 62 x 42 mm and is designed to withstand harsh environments and to perform in fast-moving applications. Application parameters are quickly established with the sensor’s Setup Wizard software that can be used with a PC. The Setup Wizard guides the user in a few steps to configure the application. The sensor can provide either digital or analog outputs.


Key features:

  • 3D sensor evaluates an object's shape, size and volume
  • Compact sensor uses reliable time-of-flight distance measurement
  • Integrated 64 x 48 pixel array projects 3072 points of reference
  • Sensor withstands harsh indoor and outdoor environments
  • Provides switching and analog outputs for application versatility

Click here for the SOBx-Q brochure

Click here for the detailed SOBx-Q product information

Click here for the detailed SOBx-M product information

SBOx-Q
      
 SBOC-Q-R1BSBOC-Q-R1CSBOI-Q-R1BSBOI-Q-R1CSBOC-Q-R2BSBOC-Q-R2C
Sensor resolution640x480640x480640x480640x4801280x10241280x1024
Exposure time (ms)0.027..1,0000.027..1,0000.027..1,0000.027..1,0000.008..1,0000.008..1,000
Framerate (fps)1501501501502727
Lens mountingc-mountc-mountintegrated lensintegrated lensc-mountc-mount
Sensor typemono/colormono/colormono/colormono/colormono/colormono/color
Working distance (mm)variablevariable22 ... 1,00022 ... 1,000variablevariable
Coverage (mm)variablevariable14x10 ... 520x39014x10 ... 520x390variablevariable
Max. no. of test programs256256256256256256
Sorting functionUp to 16 types per test program     


Met een krachtige XScale processor

HALCON Embedded intelligente camera

Ontwikkelt als de ideale tool voor kwaliteits inspectie systemen

Dit heeft de volgende voordelen:

  • Gestandaardiseerde interfaces voor Ethernet, CAN en 24V I/O
  • Sensor resolutie 640 x 480 of 1280 x 1024 pixels (mono of kleur)
  • Korte integratie tijden: de camera kan gebruikt worden voor analyses op snelle bewegende objecten of wanneer het object trilt.
  • Compact, laag gewicht
  • IP65, IP67


  • Door gebruik te maken van HALCON Embedded op de intelligente camera's van Festo

    • profiteert u van HALCON's machine vision bibliotheek op compacte en robuuste hardware
    • heeft u toegang tot alle HALCON functionaliteit
    • kunt u HDevelop programma's uitvoeren op de camera
    • kunt u eenvoudig de camera integreren in uw productieproces

Click here for the CheckSight camera brochure

[table=tables-colorful-list CheckSight range
Name | Order Number | Sensor Size | Sensor Techn. | Resolution | Frames per sec | Shutter | Color
CheckSight G32B | 000410 | 1/2 | CMOS | 659x494 | 196 | global | color
CheckSight G32M | 000411 | 1/2 | CMOS | 659x494 | 196 | global | mono
CheckSight G43AB | 000412 | 1/3 | CMOS | 752x480 | 64 | global | color
CheckSight G43AM | 000413 | 1/3 | CMOS | 752x480 | 64 | global | mono
CheckSight P133B | 000414 | 1/2.7 | CCD | 1300x968 | 9 | global | color
CheckSight P141B | 000415 | 2/3 | CCD | 1360x1024 | 20 | global | color
CheckSight P141M | 000416 | 2/3 | CCD | 1360x1024 | 20 | global | mono
CheckSight P142AB | 000417 | 1/2 | CCD | 1360x1024 | 15 | global | color
CheckSight P142AM | 000418 | 1/2 | CCD | 1360x1024 | 15 | global | mono
CheckSight P202B | 000419 | 1/1.8 | CCD | 1624x1236 | 14 | global | color
CheckSight P202M | 000420 | 1/1.8 | CCD | 1624x1236 | 14 | global | mono
CheckSight P203B | 000421 | 1/2.7 | CCD | 1640x1232 | 9 | global | color
CheckSight P32B | 000422 | 1/2 | CCD | 659x494 | 62 | global | color
CheckSight P32M | 000423 | 1/2 | CCD | 659x494 | 62 | global | mono
CheckSight P33B | 000424 | 1/3 | CCD | 659x494 | 62 | global | color
CheckSight P33M | 000425 | 1/3 | CCD | 659x494 | 62 | global | mono
CheckSight P34B | 000426 | 1/4 | CCD | 659x494 | 64 | global | color
CheckSight P34M |000427 | 1/4 | CCD | 659x494 | 64 | global | mono
CheckSight P52B | 000428 | 1/2 | CCD | 782x582 | 63 | global | color
CheckSight P52M | 000429 | 1/2 | CCD | 782x582 | 63 | global | mono
CheckSight P83B | 000430 | 1/3 | CCD | 1024x768 | 32 | global | color
CheckSight P83M | 000431 | 1/3 | CCD | 1024x768 | 32 | global | mono
CheckSight R132M | 000432 | 1/2 | CMOS | 1280x1024 | 30 | rolling | mono

Multi-Sensor Cameras

Multi-Sensor Camera Model VRm4FC-12 mOEM

The multi-sensor camera can be equipped with up to four pixel-synchronous sensors. The CMOS sensors with global shutter are connected to the central unit by a flex-foil-cable with LVDS transmission and can be freely positioned. The image data is coordinated on a FPGA module with at least 256 MB RAM. The multi-sensor camera can produce pixel-synchronous images from several positions, as required for 3D reconstruction, for example. Light-section-, Gray-code- and phase shift processes can even be applied to moving objects when using the multi-sensor camera.


Dimensions
Sensor boards: 28x19 mm
Central unit: 42x38 mm


Available Designs
Board Cameras - Design mOEM
Board cameras with lens - Design mCOB

Cameras with Remote Sensor

Camera with Remote Sensor Model VRmC-12 eCOB
For applications with tight or angled installation space VRmagic offers cameras with remote and freely position able sensors. The sensor is connected to the main unit by an up to 50 cm long flex-foil-cable with LVDS transmission.


Dimensions
Sensor board: 28x19 mm
Central unit: 42x38 mm


Available Designs
Board Camera - Design eOEM
Board camera with lens - Design eCOB

VRmagic offers cameras in housing and OEM variants. The modules can be individually configured as required.

Sensor Boards – Design OEM

Design OEM
Board dimensions: 42x38x33 mm (intelligent components) or 42x38x25 mm (with FPGA)

Board Camera with lens – Design COB „Camera On Board“

Illumination optional (white, red, IR LEDs)
Design COB
Board dimensions: 42x38x50 mm (intelligent components) or 42x38x25 mm (with FPGA)

Camera in Housing – Design PRO

Housing of High Quality Anodized Aluminum with C-Mount (Objective not included)
Design PRO
Housing dimensions: 46x46x54 mm (intelligent components) or 46x46x46 mm (with FPGA)